Automotive Camera Platform,Sensors and Imaging Contract Design,Power Electronics,COB Manufacturing,Product Miniaturization,Test Equipment Development,Rigid Printed Circuit Board Assembly,Flex Printed Circuit Assembly,Flip Chip Process,Automatic Pin Insertion,Automated back-end equipment and process development,Simultaneous Engineering,ISO/TS 16949:2009 Certified Lines,Critical Part Monitoring (CPM),Reject Profile Analysis (RPA),Parts Average Test (PAT),Statistical Bin Analysis